| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve productivity and reliability of semiconductor devices by manufacturing a lead frame to be used for batch resin sealed MAP type semiconductor devices without any deformation such as strain or torsion. <P>SOLUTION: The lead frame is constituted to manufacture respective semiconductor devices by mounting semiconductor chips on semiconductor chip mounting portions 11 of respective unit frames, forming a resin sealed body by sealing the entire region of the lead frame 10 with a resin, and then cutting the resin sealed body along tie bars 13. The lead frame is provided with a slit 15 in the half-cutting region or the coining region of a tie bar 13, and has part of lead groups, adjoining across the tie bar 13, half-cut or coined in one body including the tie bar 13. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
