| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing device preventing the occurrence of an unpolished part on a semiconductor substrate to obtain a favorable mirror finished surface, thereby remarkably increasing polish yield and productivity. <P>SOLUTION: In the polishing device 1 for the semiconductor substrate 5, abrasive cloth 4 is stuck onto a surface plate 2 to form a polishing surface 3, a plurality of semiconductor substrates 5 are stuck onto each sticking plate 6 for polishing to superpose the sticking plate 6 for polishing on the surface plate 2 so as to sandwich the semiconductor substrates 5 between the abrasive cloth 4 and the sticking plate 6 for polishing and surfaces of the semiconductor substrates 5 are polished by rotating the surface plate 2 or the sticking plate 6 for polishing around an axis orthogonal to the polishing surface 3 or moving it parallel to the polishing surface 3 while sequentially supplying an abrasive liquid 13 onto the abrasive cloth 4 and pressing the sticking plate 6 for polishing toward the abrasive cloth 4. The polishing device 1 includes air jetting parts 9 for jetting air 14 to the abrasive cloth 4. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
