| 发明名称 |
COPPER FOIL AND COPPER FOIL MANUFACTURING METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide copper foil capable of securing adhesiveness to a resin base material or the like and a method of manufacturing the copper foil. <P>SOLUTION: The copper foil 1 is provided with a copper foil material 10 having a first recessed part 15 on one surface and a copper plated layer 20 provided on one surface to have a second recessed part 25 having average depth narrower than that of the first recessed part 15 at a position corresponding to the first recessed part 15. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2010037585(A) |
申请公布日期 |
2010.02.18 |
| 申请号 |
JP20080200073 |
申请日期 |
2008.08.01 |
| 申请人 |
HITACHI CABLE LTD |
发明人 |
HASHIBA TOSHIO;MATSUMOTO YUKO;YOKOMIZO KENJI;GOTO CHIZURU |
| 分类号 |
C25D7/06;B32B15/01;C25D5/10;H05K1/09 |
主分类号 |
C25D7/06 |
| 代理机构 |
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代理人 |
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