摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of being miniaturized and manufactured inexpensively. SOLUTION: The polishing device 1 polishes a material 101 to be polished by injecting many polishing materials 100 in a container 2. The polishing device 1 includes: a reservoir part 3 formed in a lower part in the container 2 to store each polishing material 100 injected in the container 2 by falling due to self weight; a supply pipe part 4 disposed with a lower end 4a in the reservoir 3; an injection nozzle part 5 whose one end 5a is fixed to a lower inner wall 2b of the container 2 and other end 5b is opened in the container 2, and which is communicated with an upper end 4b of the supply pipe part 4 between the one end 5a and the other end 5b, is communicated with an external compressor 6 of the container 5 from the one end 5a, introduces gas, and introduces each of the polishing materials 100 from the lower end 4a of the supply pipe part 4 together with the gas, to inject the polishing materials 100 from the other end 5b; and an exhaust port 8 performing exhaust in the container 2. COPYRIGHT: (C)2010,JPO&INPIT
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