发明名称 COMPOUND MOLDING APPARATUS, AND TRANSFER DEVICE FOR INTERMEDIATE MOLDED ARTICLE OF COMPOUND MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve a transfer device as a device different from a device for taking out a molded article, which is incorporated in a compound molding apparatus which molds a compound molded article composed of different colors or different materials by a plurality of molding stages mounted on one die clamping device and transferring an intermediate molded article molded at respective molding stages to subsequent molding stages. SOLUTION: This compound molding apparatus comprises the molding stages disposed in the die clamping device as molding stages having housing spaces formed among them, the transfer device housed in the die clamping device, a holding fixture for the intermediate molded article configured so as to wait in the housing spaces while closing the molding die and to reciprocate between the molding stages adjacent each other while opening the molding die, and the die clamping device and an ejector device which is configured as a device for departing the holding fixture from the intermediate molding article. Furthermore, the transfer device of the compound molding apparatus is configured as a device for reciprocating the holding fixture between the molding stages adjacent each other and waiting in the housing space. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010036567(A) 申请公布日期 2010.02.18
申请号 JP20080205837 申请日期 2008.08.08
申请人 SODICK PLASTECH CO LTD 发明人 FUJIKAWA MISAO
分类号 B29C33/44;B29C45/14;B29C45/16;B29C45/42 主分类号 B29C33/44
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