| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which disconnection of an air bridge wiring part is prevented by passing a water pressure through in dicing. Ž<P>SOLUTION: The present invention relates to a semiconductor device comprising: a semi-insulated substrate on a semiconductor chip; a gate finger electrode, source finger electrode and drain finger electrode being disposed on a surface of the semi-insulated substrate and each including a plurality of fingers; a gate terminal electrode, a source terminal electrode and a drain terminal electrode being disposed on the surface of the semi-insulated substrate and formed by bundling the plurality of fingers, respectively, for each of the gate finger electrode, the source finger electrode and the drain finger electrode; and an air bridge wiring part connecting a predetermined number of source finger electrodes to the source terminal electrode, wherein the air bridge wiring part is disposed obliquely at about 30° or more, for example, to a dicing direction. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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