发明名称 Arrangement of a laser machining head for removing layers, comprises a laser beam, a focusing- or imaging unit, an auto-focusing unit and a lateral position-positioning unit
摘要 The arrangement of a laser machining head comprises a laser beam (62), a focusing- or imaging unit (71), an auto-focusing unit (81) and a lateral position-positioning unit. The laser beam has a rectangular or quadratic cross-section. The intensity distribution of the laser beam is homogenous in a direction. The laser beam is produced by a fiber laser, and a Q-switched microlaser. The light-transmitting core has a rectangular cross-section. The microlaser is pumped with a diode laser, where the pumped volume has rectangular cross-section, and is integrated in the laser machining head. The arrangement of a laser machining head comprises a laser beam (62), a focusing- or imaging unit (71), an auto-focusing unit (81) and a lateral position-positioning unit. The laser beam has a rectangular or quadratic cross-section. The intensity distribution of the laser beam is homogenous in a direction. The laser beam is produced by a fiber laser, and a Q-switched microlaser. The light-transmitting core has a rectangular cross-section. The microlaser is pumped with a diode laser, where the pumped volume has rectangular cross-section, and is integrated in the laser machining head. The wavelength of the laser beam is converted by non-linear element to cause better absorption by the workpiece. The laser beam is formed on the workpiece by using a lens (72). A distance sensor and a servo circuit are used to regulate the longitudinal position on the workpiece. The distance sensor is acoustically and inductively or capacitively formed or is formed as radar, and is based on triangulation, Foucault's-cutting process, a process in combination with quadrant photodiodes and under utilizing astigmatism caused by a cylindrical lens or light propagation time method. LED or diode laser is used as light source. Photodiodes, charge-coupled device cells or charge-coupled device array are used as optical detectors in an image-resulting process. The servo circuit is implemented in analog to compact disk drive for auto focus. A track correction unit made of a unit is used for determining the lateral position in relation to a reference and the servo circuit is used to regulate the lateral position. The track correction unit implemented as in analog to a track guiding device (91) in the compact disk-drive. In the production of the thin-film solar, P1 is used with an ultraviolet-laser or laser having a wavelength of longer than 1200 nm and P2 and P3 are described with a visible laser beam, where the P1 or P2 is used as reference for track guiding. A process gas nozzle is integrated to the laser machining head. A suction nozzle is used in the laser machining head for disposing the particles caused by the process. An independent claim is included for a plant for high speed machining.
申请公布号 DE102008038119(A1) 申请公布日期 2010.02.18
申请号 DE20081038119 申请日期 2008.08.17
申请人 DU, KEMING 发明人 DU, KEMING
分类号 B23K26/08;B23K26/02;B23K26/03;B23K26/06;B23K26/38 主分类号 B23K26/08
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