| 发明名称 |
STABLE, HIGH RATE SILICON SLURRY |
| 摘要 |
The invention provides a chemical mechanical polishing composition comprising wet process silica, a stabilizer compound, a potassium salt, a secondary amine compound, and water. The invention further provides a method of polishing a substrate with the polishing composition. |
| 申请公布号 |
WO2009142692(A3) |
申请公布日期 |
2010.02.18 |
| 申请号 |
WO2009US02846 |
申请日期 |
2009.05.07 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
WHITE, MICHAEL;GILLILAND, JEFFREY;JONES, LAMON;WALTERS, ALICIA |
| 分类号 |
C09K3/14 |
主分类号 |
C09K3/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
