发明名称 HEAT RADIATION BOARD, METHOD OF MANUFACTURING THE SAME, AND MODULE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To solve a problem wherein, in the shape of a conventional heat radiation board in which only copper foil is fixed on a metal plate through an insulation layer, a terminal fixed to the copper foil may be separated by external force such as vibration. <P>SOLUTION: In this module, local strength of a part of a lead frame 15, a terminal part 16 or the like which is easily separated by external force by vibration or the like is increased by pressing a member composed of a metal plate 11, a copper foil pattern 13 fixed through an insulation layer 12 formed on the metal plate 11 and lead frames 15 and terminal parts 16 formed thereon toward the metal plate 11 by a structure 18 formed of a resin or the like. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010040900(A) 申请公布日期 2010.02.18
申请号 JP20080203980 申请日期 2008.08.07
申请人 PANASONIC CORP 发明人 KONO HITOSHI;ONISHI TORU
分类号 H01L23/36 主分类号 H01L23/36
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