| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering apparatus reducing an erosion area during main sputtering compared with that during pre-sputtering, allowing target particles deposited in a non-erosion area during the pre-sputtering to be hardly peeled during the main sputtering, thereby suppressing the deposition of the peeled particles on a substrate. Ž<P>SOLUTION: The sputtering apparatus includes a first magnetic body in which a plurality of magnetic bodies are located at a center of a target support, and a second magnetic body located on the outer circumferential side of the target support with respect to the first magnetic body. The second magnetic body is movable from the first position to the second position in a plane of the target support on the side opposite from a substrate support. The first position is the position at which any film deposition is not performed on the substrate, and the second position is on the center side of the target support with respect to the first position, and the position at which the film deposition is performed on the substrate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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