发明名称 SHEET THICKNESS CONTROL
摘要 A method and apparatus for forming a sheet are disclosed. A melt is cooled and a sheet is formed on the melt. This sheet has a first thickness. The sheet is then thinned from the first thickness to a second thickness using, for example, a heater or the melt. The cooling may be configured to allow solutes to be trapped in a region of the sheet and this particular sheet may be thinned and the solutes removed. The melt may be, for example, silicon, silicon and germanium, gallium, or gallium nitride.
申请公布号 WO2010019695(A2) 申请公布日期 2010.02.18
申请号 WO2009US53588 申请日期 2009.08.12
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES;KELLERMAN, PETER, L.;CARLSON, FREDERICK;SINCLAIR, FRANK 发明人 KELLERMAN, PETER, L.;CARLSON, FREDERICK;SINCLAIR, FRANK
分类号 H01L31/042 主分类号 H01L31/042
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