SURFACE-MOUNTING MACHINE USING OPTICAL BEAM

摘要

Disclosed is a surface-mounting machine (10) that is suitable for electronic components having terminals to which the solder is already attached, and particularly for rear surface contact type electronic components. The machine is equipped with a laser head (200) that irradiates a solder bump terminal (101) of a BGA electronic component (100) and the lands (103) of a printed wiring board (107) with a laser beam, and an adhesion nozzle (353) that, after the laser beam has been emitted by the laser head (200), lowers the BGA electronic component (100), stopping in close proximity to the printed wiring board (107) and releases the component to place same on the printed wiring board (107).