发明名称 ALUMINUM RIBBON FOR ULTRASONIC BONDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding ribbon that homogeneously bonds over the whole surface of a junction surface each time even if the bonding is made several tens of thousand times, and achieves a stable bonding strength. <P>SOLUTION: There is provided an aluminum ribbon for ultrasonic bonding consisting of an aluminum alloy of &ge;99 mass% in purity, which includes the additive element and the balance composed of aluminum. This ribbon has an extremely thin tape structure obtained by rolling after multistage wire drawing, the average of the crystal grain diameter in the cross-section of the ribbon is 5 to 200 &mu;m, and a ratio of thickness to width of the ribbon is 1/2 to 1/20. Preferably, an aspect ratio (width direction/thickness direction) of the crystal grain diameter is 0.5 to 10, and a mirror finish is made with a surface roughness of R<SB>z</SB>&le;2 &mu;m. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010040763(A) 申请公布日期 2010.02.18
申请号 JP20080201994 申请日期 2008.08.05
申请人 TANAKA ELECTRONICS IND CO LTD 发明人 MIKAMI MICHITAKA;KIKUCHI TERUO;HIRATA YUICHI;NAKAJIMA SHINICHIRO;SATO MATSUMI;KIMURA KEISUKE
分类号 H01L21/60 主分类号 H01L21/60
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