| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make it possible to expand a bonding area and to avoid damage on elements, a substrate, element electrodes, substrate wiring, etc., in the ultrasonic bonding method. <P>SOLUTION: The ultrasonic bonding method is used to bond a bonding member 1 to a member 2 to be bonded by press-fitting the bonding member 1 to the member 2 to be bonded and applying ultrasonic vibration to the bonding member 1. The bonding member 1 and the member 2 to be bonded contain copper mainly, and a tin layer 4 made mainly of tin is interposed between the bonding faces 11 and 21 of the bonding member 1 and the member 2 to be bonded. While the tin layer 4 is pinched, the bonding member 1 is press-fitted to the member 2 to be bonded in, and ultrasonic vibration is applied to the bonding member 1 at normal temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
