| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for attaining highly reliable sealing with respect to an electronic component and a semiconductor element which uses a sealing resin. SOLUTION: A semiconductor module 10 is provided with: an element mounting substrate 18 having a wiring layer 22; a semiconductor element 12 mounted on the element mounting substrate 18; a first electronic component 14 mounted on the element mounting substrate 18 and having an element part in the internal space; and a sealing resin 20 for sealing the semiconductor element 12 and the first electronic component 14. The first electronic component 14 includes a metal member 14a, arranged between the element mounting substrate 18 and the electronic component, and which covers the lower surface of the first electronic component 14. COPYRIGHT: (C)2010,JPO&INPIT |
