| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus for preventing the combination of a substrate during drying treatment. SOLUTION: Drying treatment is carried out to a wafer W in a drying treatment area DA installed above a chemical treatment area CA. When the final rinse treatment ends, a rotational member elevating mechanism 87 is driven, and the wafer W held by a substrate holding member 4 is made to rise from the chemical treatment position to a drying treatment position (positions shown by the figure). In the drying treatment, a CDA valve 29 is opened, and the CDA is delivered from the delivery port of a CDA unit 26 and CDA nozzle 109 to its downward direction. Thus, clean air and CDA from the delivery port of an FFU 2 can be sprayed from the upper part to the surface of a wafer W positioned at the drying treatment position. COPYRIGHT: (C)2010,JPO&INPIT |
