发明名称 |
METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE |
摘要 |
An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
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申请公布号 |
US2010037445(A1) |
申请公布日期 |
2010.02.18 |
申请号 |
US20090603913 |
申请日期 |
2009.10.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO YOUN-SUNG;BYUN HAK-KYOON;WOO JUNG-HWAN;SONG HYUN-JUNG |
分类号 |
B23P19/04 |
主分类号 |
B23P19/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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