发明名称 METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE
摘要 An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
申请公布号 US2010037445(A1) 申请公布日期 2010.02.18
申请号 US20090603913 申请日期 2009.10.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO YOUN-SUNG;BYUN HAK-KYOON;WOO JUNG-HWAN;SONG HYUN-JUNG
分类号 B23P19/04 主分类号 B23P19/04
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