APPARATUS FOR BONDING SUBSTRATES OF WHICH THE SIZE IS VARIOUS

摘要

PURPOSE: An apparatus for bonding substrates in various sizes is provided to simplify the process for bonding substrates by loading a substrate in a guide hole without a substrates arrangement and a separate lift operation by size. CONSTITUTION: A guiding hole(H) with an inner gage become smaller as descending downward is formed vertically in a substrate frame(20). A substrate(31) is horizontally loaded by a step part supporting the substrate(21) and the edge of the substrate is slung on the side wall of the hollow of the substrate frame. A plurality of the step parts supporting the substrate are formed with a tiered shape and the larger substrate is horizontally loaded on the upper step part. A lifter(10) is installed to move vertically according to the guide hole. The lifter holds the bottom of the substrate loaded on the step part supporting the substrate and transfers the substrate vertically.