| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper insulation bonding wire using Cu lower in cost and higher in joining property than Au as a core material to prevent electric short circuit caused by contact of a loop upon sealing with a resin, excellent in stitch bonding and allowing formation of a favorable completely spherical ball. <P>SOLUTION: The copper insulation bonding wire is characterized in that an insulating film of a thermosetting resin containing a 50 to 200 nm thick thermosetting copolymer type polyimide resin as a main component is formed on the surface of a copper fine wire via a 10 to 100 nm thick palladium thin film layer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
