摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a circuit board for mounting a switching element and to appropriately radiate heat, without changing the size of a housing case. Ž<P>SOLUTION: The electrical component includes: a circuit board 11 whose plane shape is formed in a rectangular shape and on which an electric circuit is mounted; a case 10 for housing the circuit board 11; a heat radiation board 40, provided on one long side of the circuit board 11 and thermally connected to the inner surface of the case 10; and an FET 30 as a switching element which configures a part of the electric circuit and is mounted on the circuit board 11 so as to position at least a part of a mold part 31 on the heat radiation board 40, by being coincided in the direction of a terminal, extending from the mold part 31 with the longitudinal direction of the circuit board 11. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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