| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a component built-in substrate which is compact and high in reliability by forming an interlayer connection conductor having a small aperture and high straightness. <P>SOLUTION: After a component 5 is embedded in a second layer 4, the second layer is cured, and the interlayer connection conductor 6 which is a through-hole penetrating the second layer 4 from an upper surface to a lower surface is formed in the cured second layer 4. Then, an in-plane conductor 2, an uncured first layer 3 made of an anisotropic conductive material, and a second layer 4 are laminated in order from below, and integrated by the curing of the first layer 3 to manufacture the component built-in substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
