发明名称 |
INSPECTION DEVICE OF SOLDER MATERIAL AND INSPECTION METHOD OF SOLDER MATERIAL |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inspection device of a solder material and an inspection method of the solder material capable of simply enhancing measuring precision of a degradation level of the solder material. <P>SOLUTION: The inspection device of the solder material and the inspection method of the solder material include: a light projection part for irradiating the solder material applied to the surface of the base material to be flattened with irradiation light; a light receiving part for receiving the diffused reflected light of the light projected from the light projection part; a housing which houses the light projection part and the light receiving part and a window part capable of permitting the irradiation light and the diffused reflected light to pass; a support part for supporting the housing at a predetermined height from the surface of the flattened solder material, and a processing part for processing the output signal of the light receiving part. The processing part allows the light receiving part to detect the diffused reflected lights obtained from a plurality of the different regions of the surface of the solder material according to a relative change in the horizontal positions of the surfaces of both of the housing and the solder material to collect a plurality of light receiving data and inspects the degradation level of the solder material on the basis of a plurality of the light receiving data. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010038545(A) |
申请公布日期 |
2010.02.18 |
申请号 |
JP20080197984 |
申请日期 |
2008.07.31 |
申请人 |
OMRON CORP |
发明人 |
TAKASHIMA JUN;EGAWA KOICHI |
分类号 |
G01N21/956;G01N21/35;H05K3/34 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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