| 摘要 |
A laser processing apparatus includes a stage unit moving a substrate having a plurality of work sections along longitudinal and lateral axes and rotating the substrate at a predetermined angle about a rotational axis, a laser beam oscillating unit oscillating laser beams to process holes in the substrate, a camera unit taking and providing an image of each of the work sections, and a controller correcting a processing location data using the image taken by the camera unit to allow the laser oscillating unit and the scanner unit to accurately process the holes in the substrate.
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