| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric device, which can prevent gas generated from a sealing material during the dissolution of the sealing material from being left in a package of the piezoelectric device. Ž<P>SOLUTION: The method for manufacturing the piezoelectric device includes: a first junction process (S11) for joining a vibration piece, a wafer for a piezoelectric frame having an outer frame surrounding the vibration piece and a base wafer having a through-hole in atmosphere; a sealing process (S12) for sealing the through-hole with a filler in atmosphere; a second junction process (S13) for joining a lid wafer with the piezoelectric frame in vacuum or in an inert atmosphere; and a dicing process (S14) for dicing the joined piezoelectric frame wafer, base wafer and the lid wafer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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