| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing composition that improves reliability of semiconductor devices produced through a process using a flux agent. SOLUTION: The liquid sealing resin composition is for sealing a space between a semiconductor element and a substrate after jointing the semiconductor element and the substrate by solder bump using a flux agent in the case of reflowing a solder, and comprises (A) an epoxy resin, (B) an amine-based curing agent, and (C) at least either one of 1,8-diazabicyclo(5.4.0)undecene-7, 1,5-diazabicyclo(4.3.0)nonene-5 and their salts for removing residue of the flux agent existing around the solder bump. COPYRIGHT: (C)2010,JPO&INPIT
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