| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat sink for cooling an electronic component, which can achieve noise reduction of an electronic device without providing any new space and pressure loss component outside an electronic device case. Ž<P>SOLUTION: Part of a cooling air inflow surface 1 and a cooling air outflow surface 2 of a heat sink is inclined against the vertical direction of a contact surface of a contact part (heat sink base) with a heat generating body, whereby the generation of eddy caused by the contact with the cooling air and the residence of eddy in the vicinity of the heat sink are suppressed; the reduction of liquid noise and the improvement of the cooling efficiency are achieved; and the noise reduction of an electronic device can be achieved without providing any new space and large pressure loss component. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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