ADHESIVE FOR ELECTRONIC COMPONENT, SEMICONDUCTOR CHIP STACKING METHOD, AND SEMICONDUCTOR DEVICE

摘要

This invention provides an adhesive for an electronic component which can realize the connection of one electronic component to another electronic component or a support member parallel to each other while providing an accurate gap distance, semiconductor chip stacking method using the adhesive for an electronic component and a semiconductor device. The adhesive for an electronic component is used for stacking one electronic component and another electronic component or a support member parallel to each other while providing a gap distance of not more than 30μm. The adhesive for an electronic component contains a curable compound, a curing agent, and spacer particles, and has a viscosity of not more than 50 Pa s as measured with E-type viscometer at 10 rpm and at a temperature at which the one electronic component is bonded to the another electronic component or the support member. The spacer particles have a CV value of not more than 10%. The average particle diameter is 40 to 70% of the gap distance between the one electronic component and the another electronic component or the support member.