| 摘要 |
A method of bonding electrodes and core wires capable of shortening the operation time and improving the bonding strength and an electronic unit formed by bonding the electrodes and the core wires are intended to be provided. After supplying a thermosetting resin (8a) incorporated with solder particles (7a) so as to cover a plurality of electrodes (3) on a substrate (2), arranging each of core wires (6) while opposing vertically to each of the electrodes (3) above the substrate (2), locating a sheet member (11) above the core wires (6), hot pressing each of the core wires (6) and the thermosetting resin (8a) by way of the sheet member (11) by hot press bonding tool (12) from above the sheet member (11) to thermally cure the thermosetting resin (8a) and melt the solder particles (7a) contained in the thermosetting resin (8a), detaching the hot press bonding tool (12) from the thermally cured product (8) of the thermosetting resin (8a), bonding the core wires (6) and the electrodes (3) by the solidification product (7) of solder formed by solidification of a molten product of the solder particles (molten solder (7b)) and, finally, peeling the sheet member (11) from the thermally cured product (8). |
