Materials for adhesion enhancement of copper film on diffusion barriers

摘要

State-of-the-art computational chemistry techniques have been used to identify adhesion promoting layer materials that provide good adhesion of a metal seed layer, e.g. a copper seed layer, to a barrier layer. Factors responsible for providing good adhesion of copper layer on various metallic surfaces and circumstances under which agglomeration of copper film occurs have been identified. Several promising adhesion promoting layer materials based on ruthenium, tantalum, chromium and chromium alloys have been predicted to be able to significantly enhance the adhesion of copper films. Chromium containing complexes of a polydentate ²-ketoiminate have been identified as chromium containing precursors to make the alloys with chromium.