CMP slurry composition for the phase change memory materials and polishing method using the same,申请号KR20070065874-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	CMP slurry composition for the phase change memory materials and polishing method using the same
摘要
申请公布号	KR100943020(B1)	申请公布日期	2010.02.17
申请号	KR20070065874	申请日期	2007.06.29
申请人		发明人
分类号	C09K3/14	主分类号	C09K3/14
代理机构		代理人
主权项
地址

您可能感兴趣的专利

FIREPROOF PARTITIONING DEVICE

DISPOSABLE STOOL CLEANING PAPER SHEET

CONCRETE-FILLED BEAM

FIREPROOF PARTITIONING DEVICE

METHOD AND STRUCTURE FOR CONSTRUCTING WOODEN

JOINT DEVICE FOR FLOOR

BEARING WALL STRUCTURE

BEARING PLATE AND STABILIZATION METHOD FOR CUT SLOPE USING THE BEARING PLATE

GUARD FENCE AGAINST FALLING STONE AND SNOW

LIQUID CRYSTAL COMPOSITION AND ITS PRODUCTION

POLYAMIDE RESIN COMPOSITION AND ITS PRODUCTION

PHENOLIC RESIN MOLDING MATERIAL

PRODUCTION OF POLYPROPYLENE RESIN COMPOSITION

MOLDING MATERIAL

DIE HAVING NITRIDED LAYER EXCELLENT IN RESISTANCE TO HEAT AND OXIDATION, AND ITS PRODUCTION

PRODUCTION OF HYDROGEN PEROXIDE

PRODUCTION OF CERIUM ABRASIVE

PRODUCTION OF POLY-O-HYDROXYAMIDE AND POLY-O-MERCAPTOAMIDE

TWO-PACK TYPE URETHANE COATING COMPOSITION

LENS MATERIAL FOR EYE