发明名称
摘要 The present invention relates to a sealing device for resin, which is easy to provide resin materials, can reduce waste resin and shape cheaply after sealing the resin, and can be used at favorable state long-term. The sealing device for resin comprises a first metal mould (1) and a second metal mould (2) which can be connected and separated to the first metal mould (1). The molten resin at a kettle portion (59) are filled into a die cavity which is formed by the two metal modules (1 and 2) through a gate (48), thus the substrates (70) resin which is equipped with an electrical component and arranged between the two metal moulds (1, and 2) are sealed. The kettle portion is positioned in any one of the metal moulds, and is formed with dent (54c) which is divided with prescribe spacing. Thebottom surface of the dent (54c) is composed of one part of a moving component (60) which can move toward the opening. The moving component (60) is as plate shape, and at least one ditch portion (60a) is formed at any one side surface which across with the moving direction.
申请公布号 JP4417981(B2) 申请公布日期 2010.02.17
申请号 JP20070161376 申请日期 2007.06.19
申请人 发明人
分类号 B29C45/53;B29C33/72;B29C45/02;B29L31/34;H01L21/56 主分类号 B29C45/53
代理机构 代理人
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