发明名称 |
Heat dissipation apparatus |
摘要 |
<p>A heat dissipation apparatus including an insulation substrate, a heat sink, and a stress reduction member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. The heat sink is thermally coupled to the second surface of the insulation substrate. The heat sink, which includes an upper case and a lower case, serves as a liquid cooling device including a cooling passage. The stress reduction member is arranged between the insulation substrate and the upper case. The stress reduction member includes stress absorption hollows. The upper case includes a first portion that contacts the stress reduction member and a second portion defined by the remaining part of the upper case. The first portion has a thickness that is less than that of the second portion.
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申请公布号 |
EP2065933(A3) |
申请公布日期 |
2010.02.17 |
申请号 |
EP20080169492 |
申请日期 |
2008.11.20 |
申请人 |
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI;SHOWA DENKO K.K. |
发明人 |
MORI, SHOGO;YAMAUCHI, SHINOBU;TAMURA, SHINOBU |
分类号 |
H01L23/367;H01L23/373;H01L23/473 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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