发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM THEREFROM
摘要 The present invention provides a positive photosensitive resin composition including: a resin containing a specific acrylic acid-based constituent unit capable of undergoing dissociation of an acid-dissociable group to produce a carboxyl group, and a constituent unit having a functional group capable of reacting with the carboxyl group to form a covalent bond, the resin being alkali-insoluble or sparingly alkali-soluble and becoming alkali-soluble when the acid-dissociable group dissociates; and a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The present invention also provides a method for forming a cured film using the composition. The positive photosensitive composition is excellent in the sensitivity, film residual ratio and storage stability and by the method for forming a cured film using the positive photosensitive resin composition, a cured film excellent in the heat resistance, adhesion, transmittance and the like can be provided.
申请公布号 EP2154571(A1) 申请公布日期 2010.02.17
申请号 EP20080765201 申请日期 2008.06.05
申请人 FUJIFILM CORPORATION 发明人 TAKITA, SATOSHI
分类号 G03F7/039;C08F220/28;G03F7/004;H01L21/027 主分类号 G03F7/039
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