| 摘要 |
<p>Printed wiring board for generally reducing electro-magnetic, capacitive and inductive cross coupling and cross talk in electrical circuits, electronic modules, and systems utilizing dissipative carbon layers residing between layers of conventional analog, digital, radio frequency (RF), or assemblies of mixed circuitry printed wiring constructions. Connection between layers by the use of insulated vias is possible when connection to the carbon layer is not desired.
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