| 摘要 |
A microstrip line is provided which keeps the shape of ground interconnections constant with respect to signal interconnections even if there is a curved geometry and can prevent a change in area of the ground interconnections opposite to the signal interconnections due to misregistration of exposed patterns or misalignment of stacked layers in a printed wiring board including a mediated thin insulation layer such as a flexible printed wiring board wherein a solid ground cannot be used. The printed wiring board having a microstrip line structure wherein the signal interconnections have a curved geometry is characterized in that it includes linear ground interconnections (5, 9, 12, 15, 19, 26) disposed opposite to the signal interconnections (4, 6, 8, 11, 14, 18, 25) via an insulation layer (3, 10, 13) and a wiring pitch of the ground interconnections is 1/n (here, n is a natural number of 1 or 2) of the line width of the signal interconnections.
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