PURPOSE: A manufacturing method of ceramic probe card is provided to improve the reliability of a probe pin structure by using a photosensitive ceramic sheet which has a little thermal expansion coefficient with a ceramic laminated body on the ceramic laminated body. CONSTITUTION: A photosensitive ceramic sheet(21) is formed on a ceramic laminated body(11). A first photosensitive ceramic sheet is selectively removed so that a space corresponding to a junction(21a) can be formed. The metal material is charged in the removed area of the first photosensitive ceramic sheet and junction is formed. A second photosensitive ceramic sheet(22) is formed on the first photosensitive ceramic sheet. The second photosensitive ceramic sheet is selectively removed so that a space corresponding to a probe beam(22a) can be formed. The metal material is charged in the removed area of the second photosensitive ceramic sheet and the Probe beam is formed. A third photosensitive ceramic sheet(23) is formed on the second photosensitive ceramic sheet.
申请公布号
KR20100016885(A)
申请公布日期
2010.02.16
申请号
KR20080076530
申请日期
2008.08.05
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
PARK, HO JOON;CHANG, BYEUNG GYU;SON, HEE JU;KIM, SANG JIN