发明名称 |
Defect inspection method and apparatus |
摘要 |
A pattern inspection apparatus which compares images of regions, corresponding to each other, of patterns that are formed so as to be identical and judges that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.
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申请公布号 |
US7664608(B2) |
申请公布日期 |
2010.02.16 |
申请号 |
US20070776572 |
申请日期 |
2007.07.12 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORPORATION |
发明人 |
URANO YUTA;HAMAMATSU AKIRA;MAEDA SHUNJI;SAKAI KAORU |
分类号 |
G01B9/00;G06F19/00 |
主分类号 |
G01B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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