发明名称 |
Heat transfer mechanism, heat dissipation system, and communication apparatus |
摘要 |
A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped heat conductor for transferring heat to the heat dissipating part and an elastic member for imparting elasticity to the film-shaped heat conductor, the film-shaped heat conductor being formed from metal foil-type flexible heat pipes or carbon-based thermal conductive sheets.
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申请公布号 |
US7663883(B2) |
申请公布日期 |
2010.02.16 |
申请号 |
US20040871675 |
申请日期 |
2004.06.18 |
申请人 |
FUJITSU LIMITED |
发明人 |
SHIRAKAMI TAKASHI;YAMAZAKI NAOYA;IINO KAZUHIRO;TADA YOSHIAKI;UEDA SATOSHI |
分类号 |
F28D15/02;H05K7/20;H01L23/373;H01L23/433 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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