发明名称 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates |
摘要 |
A semiconductor wafer cleaning formulation, including 1-21% wt. fluoride source, 20-55% wt. organic amine(s), 0.5-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 23-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.
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申请公布号 |
US7662762(B2) |
申请公布日期 |
2010.02.16 |
申请号 |
US20050042531 |
申请日期 |
2005.01.24 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
WOJTCZAK WILLIAM A.;SEIJO MA. FATIMA;BERNHARD DAVID;NGUYEN LONG |
分类号 |
C11D3/04;C11D7/32;C09K13/00;C09K13/08;C11D1/00;C11D3/20;C11D3/30;C11D3/32;C11D7/10;C11D7/26;C11D7/28;C11D7/34;C11D11/00;C11D17/08;G03F7/42;H01L21/302;H01L21/304;H01L21/306;H01L21/3065 |
主分类号 |
C11D3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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