发明名称 |
Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same |
摘要 |
A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.
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申请公布号 |
US7663221(B2) |
申请公布日期 |
2010.02.16 |
申请号 |
US20050028553 |
申请日期 |
2005.01.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG KYUNG-LAE;LEE HEE-SEOK |
分类号 |
H01L23/14;H01L21/60;H01L23/31;H01L23/48;H01L23/495;H01L23/498;H01L23/50;H01L23/52;H01L23/58;H01L23/66;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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