发明名称 |
Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump |
摘要 |
The present invention provides a semiconductor device exhibiting an improved reliability. A semiconductor device comprises a semiconductor chip having an electrode on a surface thereof and a mounting substrate, and the electrode (aluminum electrode) of the semiconductor chip is coupled to the mounting substrate through a bump (solder bump 104). A plurality of diffusion barrier films (UBM 112) for preventing a diffusion of a material composing the bump is provided between the electrode and the bump, and the diffusion barrier film is formed to have a plurality of divided portions via spacings therebetween. |
申请公布号 |
US7663201(B2) |
申请公布日期 |
2010.02.16 |
申请号 |
US20060447966 |
申请日期 |
2006.06.07 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
YAMADA YUKIKO |
分类号 |
H01L21/44;H01L21/4763;H01L29/40 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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