发明名称 Polishing pad having groove structure for avoiding stripping of a polishing surface of the polishing pad
摘要 A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. The polishing pad contains more grinding liquid, to clean the small grinded pieces. The grinding layer does not have an acute structure and is not easily peeled to form the small grinded pieces. Therefore, grinding quality and grinding effect are improved.
申请公布号 US7662028(B2) 申请公布日期 2010.02.16
申请号 US20080139525 申请日期 2008.06.16
申请人 BESTAC ADVANCED MATERIAL CO., LTD. 发明人 FENG CHUNG-CHIH;LIU WEI-TE;HUNG YUNG-CHANG;WANG CHUN-TA;YAO I-PENG
分类号 B24D11/00 主分类号 B24D11/00
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