发明名称 A RADIATER OF MEMORY MOUDLE WITHOUT CLAMPS
摘要 PURPOSE: A heat radiator of a memory module without a clamp is provided to install resin coupling members of a female/male coupling structure, thereby improving an assembling property. CONSTITUTION: Heat sinks(10A,10B) comprise resin coupling members(30). The resin coupling members correspond to both sides of the heat sinks. Ear parts of the heat sinks are bent in an anchor shape in right/left side ends of a main body(11). The resin coupling members are fixed to the ear part and insert-injection-molded.
申请公布号 KR20100016715(A) 申请公布日期 2010.02.16
申请号 KR20080076306 申请日期 2008.08.05
申请人 PHOENIX ICP CO., LTD. 发明人 KIM, NAK HWA
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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