| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure and a mounting method that secure connection reliability by sufficiently securing area of contact with circuit board electrodes even when electrodes of a semiconductor element are very small. <P>SOLUTION: The mounting structure includes the semiconductor element 101, a circuit board 301 having electrodes 302 opposed to electrodes 102 of the semiconductor element 101, and conductive two-layer bumps 213. Second bumps 210 joined to the electrodes 302 of the circuit board 301 are formed larger than first bumps 209 joined to the electrodes 102 of the semiconductor element 101. The center axis of the first bump 209 and the center axis of the second bump 210 are not aligned with each other. <P>COPYRIGHT: (C)2010,JPO&INPIT |
