发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus etc., capable of extending an exchange cycle of a processing liquid, of preventing a substrate processing efficiency from lowering, and of reducing a cost of substrate processing. Ž<P>SOLUTION: A substrate processing apparatus 1 includes: a first processing fluid circulation system 20 for circulating a processing fluid between a tank 11 and a substrate processing mechanism 12; two adsorption towers 32, 33 for adsorbing metal ions which are contained in the processing fluid by processing substrates in the substrate processing mechanism 12; a second processing fluid circulation mechanism 34 which circulates the processing fluid in the tank 11 by supplying it selectively to either of the adsorption towers 32, 33; and a controller 28 which controls the operation of the second fluid circulation mechanism 34 so as to alternately switch the adsorption towers 32, 33 at predetermined time intervals. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010034593(A) 申请公布日期 2010.02.12
申请号 JP20090258027 申请日期 2009.11.11
申请人 SUMITOMO PRECISION PROD CO LTD 发明人 NISHIKAWA NOBUHIRO;TANAKA YUKIO;KASHIWAI TOSHIHIKO
分类号 H01L21/306 主分类号 H01L21/306
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