| 摘要 |
PROBLEM TO BE SOLVED: To introduce a press contact type device comprising a power semiconductor module, having a contact element formed as alternately provided continuous layers, and to provide a connection device electrically connected to an external conductor plate. SOLUTION: The power semiconductor module 1 has a housing 3, a first contact element 6, and a first support section 30. The first contact element 6 has a first contact portion 66a, that reaches the inside of the housing 3 from a passing guide section 34 and abuts against the connection device 2. The connection device 2 has an insulating-material forming body 22, a second contact element 24a, and a second support section 20a. The second contact element 24a has a second contact portion 240a, abutting against the first contact portion 66a of the first contact element 6, and a third contact portion 242 abutting against an external conductor plate 7, and at least one contact portion is elastically constituted with respect to the support section established at the contact portion. COPYRIGHT: (C)2010,JPO&INPIT |
