| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for electric-electronic components, which has excellent electric conductivity, strength, stress relaxation properties, bending workability, migration resistance characteristics and thermal peeling resistance of Sn plating after heating, and to provide an Sn-plated copper alloy material. SOLUTION: The copper alloy has a composition comprising, by mass, 0.1 to 0.3% Fe, 0.05 to 0.15% P, 0.04 to 0.15% Mg, 0.01 to 0.2% Sn and 0.05 to 0.5% Zn, and the balance Cu with inevitable impurities, and in which, regarding the contents of Fe, Mg and P, (Fe+Mg)/P is 2.0 to 4.0 and also satisfies the relation of Fe>Mg, and, Vickers hardness is≥130, and, in the parallel direction and in the orthogonal direction with respect to the rolling direction, a stress relaxation rate after heating at 150°C for 1,000 hr is≤35%, and Sn plating is not peeled even after heating at 150°C for 1,000 hr. COPYRIGHT: (C)2010,JPO&INPIT
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