| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition excellent in developability and capable of forming a cured film excellent in characteristics such as hardness, soldering heat resistance, chemical resistance, adhesion, PCT (pressure cooker test) resistance, electroless gold plating resistance, whitening resistance, electric insulation and flexibility. SOLUTION: The alkali-developable curable composition contains (A) a carboxylic group-containing resin having an acid number of 20-200 mgKOH/g and soluble in an organic solvent, which is obtained by forming a reaction product (c) by allowing one or more kinds of monocarboxylic acids (b) to react with the epoxy group of a resin (a) having two or more epoxy groups in one molecule, in a proportion of totalized 0.3-0.9 mole per equivalent of the epoxy group and then by reacting, to the epoxy group of the obtained reaction product (c), a polybasic acid (d) in a proportion of 1-5 moles per equivalent of the epoxy group; (B) a carboxylic group-containing compound; (C) a photosensitive (meth)acrylate compound; and (D) a photoinitiator. COPYRIGHT: (C)2010,JPO&INPIT
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