| 摘要 |
PURPOSE: A dicing-die bonding film is provided to ensure excellent holding strength when dicing the thin semiconductor wafer and peeling property when peeling off the semiconductor chip, and good balanced characteristics. CONSTITUTION: A dicing-die bonding film comprises a dicing film having a pressure-sensitive adhesive layer(2) on a base(1) and a die-bonding film(3) provided on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is formed from an acrylic polymer comprising an acrylic ester A represented by CH2=CHCOOR1 (wherein R1 is an alkyl group having 6 to 10 carbon atoms), an acrylic ester B represented by CH2=CHCOOR2 (wherein R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecule, the compounded ratio of the acrylic ester A and the acrylic ester B is 40 to 10 mol% of the acrylic ester B to 60 to 90 mol% of the acrylic ester A. The compounded ratio of the hydroxyl group-containing monomer is in a range of 10 to 30 mol% to 100 mol% of the total of the acrylic ester A and the acrylic ester B. The compounded ratio of the isocyanate compound is in a range of 70 to 90 mol% to 100 mol% of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin. |
