| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-zinc alloy electroplating bath which provides a plated film stable over time although the bath contains no cyano-compound, and to provide a wire electroplated with a copper-zinc alloy for steel cord. SOLUTION: The copper-zinc alloy electroplating bath contains a copper salt, a zinc salt and sorbitol. Preferably, the copper-zinc alloy electroplating bath further contains at least one selected from amino acids or their salts. The ratio (S/M) of the volumetric molar concentration S of the sorbitol to the total volumetric molar concentration M of copper ions and zinc ions contained in the bath is preferably 2.0-6.2%. COPYRIGHT: (C)2010,JPO&INPIT |
